Technology: MCOB LED Light Engine Core

Thanks to the use of this innovative platform, LED lighting fixtures become future-proof. In this way it is possible to use technological advances to improve the efficiency of lighting systems with LED and reduce costs. A LED lighting fixture designed based on the MCOB LED automatically takes advantage of the progress of the development of LED, without expensive modifications to the basic design.

Multi Cups / Chip on Board

With the system "Multi Cups / chip on board", the low-power chips are arranged in a specific gradation and covered by a layer of phosphor. The advantages of this system are an extremely homogeneous distribution of light and a light-emitting surface extremely slow.

MCOB LED technology for sustainable

The MCOB LED light engine includes variants from 400 to 5000 lumens with a luminous efficiency of up to 100-130 lumens per watt. The modules of 57 mm diameter circular offer a choice of color temperatures between 2,800, 4,500 and 6,500 Kelvin with a color rendering index (CRI) of between 75 and over 85.

MCOB LED Light Engine Core

The LED light engine MCOB Core are based on 3 different principles:

  • the "Multi Cups / Chip on Board" (MCOB) LED Aluminum substrate
  • the "Multi Cups / Chip on Board" (MCOB) LED ceramic substrate
  • the "Multi Cups / Chip on Board" (MCOB) LED crystal glass substrate
Affiliates

MCOB of LED light source on ceramic substrate


MaterialAloxite
Thermal resistance (K/W)0.3
Thermal Conductivity (W/mK)29.3
Insulativity (KV/mm)22.6

6 grooves on ceramic plate with function of anti-interference and anti-static. Gold foil encapsulation increases LM/W up to 130LM/W. But cost is higher.


MCOB  LED Light Source Crystal GlassS ubstrate

MCOB fo LED light source on crystal glass substrate


MaterialSIOX
Thermal resistance (K/W)0.3-0.5
Thermal Conductivity (W/mK)0.8-4.5
Insulativity (KV/mm)4-8

Silver conducted on SIOX surface. Gold foil encapsulation. 130LM/W . Crystal glass has insufficient heat dissipation


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MCOB of LED light source on Aluminum substrate


MaterialAluminum
Thermal resistance (K/W)0.75
Thermal Conductivity (W/mK)225
Insulativity (KV/mm)Non-insulating

6 grooves on Aluminum base, insulating treatment. Gold foil integrated circuit packaging . Luminous efficacy increased to 130LM/W. However, conductive problem should be paid attention to.