As we know, most of COB encapsulation technologies, including the one of Japan, are based on the encapsulation of the aluminum base, which assemble some chips to be encapsulated on the aluminum base. This is what we call the COB technology. The substrate of the aluminum is copper foil, which can only well conduct electric but it can`t process optical processing very well.
Feature of the lamps is MCOB (Multiple Chip Cups On Board) technology, the effect of which amounted to more than 100 - 130 lumens per watt. that can significantly improve the cooling of the LED crystals and increase the efficiency of the lamp. Lamps series.